"Using machine learning algorithms to predict failure on the PCB surface under corrosive conditions", Sajjad Bahrebar, Sajad Homayoun, Rajan Ambat, Corrosion Science 206:110500, 2022, DOI: 10.1016/j.corsci.2022.110500
"Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study", Peng Xue, Amir Sajjd Bahman, Francesco Iannuzzo, Helene Conseil Gudla, Anish Rao Lakkaraju, Rajan Ambaat, Microelectronics Reliability 139:114796, 2022, DOI: 10.1016/j.microrel.2022.114796
"Transient risk of water layer formation on PCBAs in different climates: Climate data analysis and experimental study", Helene Conseil-Gudla, Max Spooner, Murat Kulachi, Rajan Ambat, Microelectronics Reliability 136:114655, 2022, DOI: 10.1016/j.microrel.2022.11465
"A climate classification for corrosion control in electronic system design", max Spooner, Rajan Ambaat, Hélène Conseil-Gudla, Murat Kulachi, Machine Learning with Applications 9:100397, 2022, DOI: 10.1016/j.mlwa.2022.100397
"Time to Failure Prediction on a Printed Circuit Board Surface Under Humidity Using Probabilistic Analysis", Sajjad Bahrebar, Rajan Ambaat, Journal of Electronic Materials 51:4388-4406, 2022, DOI: 10.1007/s11664-022-09668-7
"Investigation of critical factors effect to predict leakage current and time to failure due to ECM on PCB under humidity", Sajjad Bahrebar, Rajan Ambaat, Microelectronics Reliability 127:114418, 2021, DOI: 10.1016/j.microrel.2021.114418
"Reflow Residues on Printed Circuit Board Assemblies and Interaction With Humidity", Helene Conseil-Gudla, Feng Lin, Rajan Amaat, IEEE Transactions on Device and Materials Reliability 21:4:594-602, 2021, DOI: 10.1109/TDMR.2021.3120941